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SEMICONDUCTOR ADHESIVE TAPES

Premium UV curable and non-UV curable tapes

Highly customisable dicing tape, package dicing tape, back grinding tapes, detaping tapes and all cleanroom tapes.

1. DICING TAPES

Tesglo's high-end dicing tapes can protect your wafer substrates, prevent your chips from flying, and the dicing tapes will have low adhesion after UV irradiation.

2. PACKAGE DICING TAPES

Our premier package dicing tapes safeguard your chips from flying off, enable easier pick-up of your chips and they leave absolutely no residue on the package.

3. BACK GRINDING TAPES

Tesglo's back grinding tapes can prevent the penetration of dust and water, improve the Total Thickness Variation (TTV), protect your wafer substrates, and absorb high mechanical stress.

4. DETAPING TAPES

Our premium series of detaping tapes are suitable for auto detaping processes, and they have excellent initial tack and wettability on various substrates.

Tesglo's Semiconductor Adhesive Tapes

Comprising most products we hold and explained in detail

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