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SEMICONDUCTOR ADHESIVE TAPES USAGES

Learn where and when you can use Tesglo's semiconductor tapes

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1. Forming The Wafer Pattern

This step involves forming the pattern on the wafer. After the photomask experience light exposure, the pattern will be printed and developed on the wafer.

2. Etching

Once the oxidised layer is etched partially, you will obtain I.C.

3. IC COMPLETION

After approximately 300-400 processes, the I.C. will be completed on the wafer.

4A. Wafer Surface Protection

This process involves protecting the wafer's surface by laminating Tesglo's protective tape to prevent foreign materials from penetrating the wafer's surface.

4B. Wafer Surface Grinding

As the wafer's surface is grinded by a specified thickness, the wafer gradually thins.

4C. Protective Tape Removal

You can remove the protective tape after the grinding process. In the case of Tesglo's UV tape, remove after UV irradiation.

5A. Tape Lamination

When dicing the wafer, Tesglo's tapes are laminated on the wafer to prevent the chips from flying.

5B. Dicing

The wafer will be diced according to the specified chip size.

5C. Pick Up

The sawn chip on the wafer will be picked up. For Tesglo's UV tape, the chip will be picked up after UV irradiation.

6A. Tape Lamination

During package dicing, Tesglo's tapes are laminated on the dicing frame to prevent the chips from flying.

6B. Package Dicing

Each package will be sawn according to the specified size.

6C. Pick Up

The sawn package will be picked up. However, for Tesglo's UV tapes, remove after UV irradiation.

IC PACKAGE

Completed IC Package.
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