ARE YOU READY TO EMBARK ON AN EDUCATIONAL ADVENTURE?
1. Forming The Wafer Pattern
This step involves forming the pattern on the wafer. After the photomask experience light exposure, the pattern will be printed and developed on the wafer.
Once the oxidised layer is etched partially, you will obtain I.C.
3. IC COMPLETION
After approximately 300-400 processes, the I.C. will be completed on the wafer.
4A. Wafer Surface Protection
This process involves protecting the wafer's surface by laminating Tesglo's protective tape to prevent foreign materials from penetrating the wafer's surface.
4B. Wafer Surface Grinding
As the wafer's surface is grinded by a specified thickness, the wafer gradually thins.
4C. Protective Tape Removal
You can remove the protective tape after the grinding process. In the case of Tesglo's UV tape, remove after UV irradiation.
5A. Tape Lamination
When dicing the wafer, Tesglo's tapes are laminated on the wafer to prevent the chips from flying.
The wafer will be diced according to the specified chip size.
5C. Pick Up
The sawn chip on the wafer will be picked up. For Tesglo's UV tape, the chip will be picked up after UV irradiation.
6A. Tape Lamination
During package dicing, Tesglo's tapes are laminated on the dicing frame to prevent the chips from flying.
6B. Package Dicing
Each package will be sawn according to the specified size.
6C. Pick Up
The sawn package will be picked up. However, for Tesglo's UV tapes, remove after UV irradiation.
Completed IC Package.